2027 Summer Intern - Sights and Electro-Optical Sensors
General Dynamics Land Systems | |
401(k)
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United States, Michigan, Sterling Heights | |
38500 Mound Road (Show on map) | |
Oct 23, 2026 | |
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About the Role The General Dynamics Land Systems Summer 2027 Internship Program provides an opportunity for students looking to start or continue the transition from academia into industry. Our three-month internship assignments provide compensation based on area of study and class standing, and have the students embedded in key functional areas of our business, getting real-world experience and mentorship from seasoned professionals.As part of your summer experience, you will join our team and use your education, experience, and creativity to make an impact. This is an internship position within Engineering supporting design activities in the Lethality Sensors Hardware area. General Dynamics is a successful Fortune 100, global aerospace and defense company, with over 90,000 employees world-wide. General Dynamics Land Systems, a business unit of General Dynamics, has a strong foundation of delivering core engineering and manufacturing capabilities to our clients for military vehicles. Our team is focused on continuous process and productivity improvements that reduce product costs, while increasing troop safety and effectiveness. Land Systems continues to work with the US Armed Forces and its Allies to ensure these vehicles remain survivable, relevant, flexible, affordable and capable of addressing a dynamic threat environment. What We Offer Whether you are starting your career or an experienced professional, we offer a Total Rewards package that is impactful and built for you.
Responsibilities to Anticipate in this Role
Qualifications Sought
Additional Information / Desired Experience
Vehicle Harness Design; Siemens Capital suite Digital and Analog circuit design including power and thermal analysis Schematic development, component selection, circuit simulation, and PCB layout Microprocessor-based products including processors, chipsets, memory, and bus interfaces, networking standards (PCI-press, DDR2, DDR3, USB, etc.) HC12 Microcontroller and x 86 Power PC Single board Computer, FPGA development / experience Industry interface standards and form factors (VITA 442/446, COM Express, etc.) Networking products, H/W, S/W, Switches, Routers, OSI Lurers Network storage (NAS, SAN), Solid State and Rotating Drive Technologies, interfaces, and Protocols Ethernet Networks and Ethernet network tools (Wireshark) Serial Interconnects, USB, CAN, RS422, etc... Graphics/video interfaces (DVI, HDMRI, RS 179, DP, CoaXpress etc...) Familiarity or experience with controls, controllers, sensors, and/or control logic Familiarity with Pro Engineer or similar CAD systems We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us. | |
401(k)
Oct 23, 2026